Xindeco IoT has been honored with the China Patent Award for its RFID inlay technology featuring a “dual-dipole design,” developed in 2012.
Technical Breakthrough: Solving Industry Challenges with a Dual-Dipole Design
“Traditional UHF RFID inlays have a figure-eight radiation blind spot, which affects performance in complex environments,” said Qiu Yanwei, R&D Manager at Xindeco IoT and one of the lead inventors. In 2012, when most of the industry was still using half-wave dipole designs, the Xindeco IoT team identified a major drawback: in stacked tags or complex environments, the “waist” of the figure-eight blind spot often caused missed reads, limiting the ability to achieve high-quality bulk reading.
After extensive research, the team introduced a patented dual-dipole design that achieved full-angle radiation coverage, significantly improving bulk read rates. Field test results showed that the inlay could stably read more than 300 items in a single scan. This technology has proven valuable in logistics, supply chain management, and electronic toll collection, and has also been applied effectively in niche scenarios such as apparel bulk reading, rosewood furniture management, and parcel sack inventory for express delivery.
Industry Impact: From Innovation to Implementation
Back in 2012, the RFID industry faced numerous challenges, including immature chip and antenna technologies, underdeveloped gate reader equipment, and limited experience in bulk reading. Xindeco IoT’s technical breakthrough had a positive impact on industry growth, helping accelerate the implementation of large-scale RFID projects in China. In 2014, after a menswear brand adopted RFID technology, its supply chain efficiency improved significantly, driving the expansion of RFID applications from supply chains to stores and customer lifecycle management.
Continuous Innovation: The “VersaMini” Series Demonstrates Technological Strength
Innovation never stops. In 2024, Xindeco IoT launched the “VersaMini” series of inlays to further meet the demand for stable performance in complex environments. Key features include:
Size innovation: With antenna-cutting technology, the standard size is 35×15 mm, with a minimum of 33×13 mm, making it suitable for mini cosmetics, small jewelry, and other tiny products without blocking packaging text or graphics.
Performance upgrade: Equipped with next-generation chips and a wider frequency tuning range, the inlays deliver more stable data transmission in complex retail environments such as supermarkets and shopping malls.
Versatile formats: Through innovative packaging design, the tags can be made into metal-flag labels, jewelry hangtags, and more. They support flat, hanging, and wrapped applications, and enable accurate reading on liquid products or irregular packaging.
Commitment and Responsibility: Driving Economic Growth Through Technology
Winning the China Patent Award not only recognizes Xindeco IoT’s R&D capabilities and technological achievements but also affirms the value of RFID technology. Reflecting on the award, Qiu Yanwei emphasized that this patented technology has accelerated the clustering of the RFID industry chain in Xiamen, boosting local economic development and enhancing the industry’s overall competitiveness.
Building on this achievement, Xindeco IoT will continue its commitment to innovation: on one hand, advancing R&D to provide more efficient solutions that help businesses reduce costs and increase efficiency; on the other, assuming industry responsibility by cultivating talent and contributing to the improvement of technical standards. The company aims to accelerate the adoption of RFID in logistics, retail, and smart manufacturing, leveraging technological innovation to empower economic and social progress, and contributing Xindeco’s strength to the advancement of China’s RFID industry.
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