From November 15 to 17, the 18th International Internet of Things Exhibition (IOTE) was successfully held at the Shenzhen World Exhibition & Convention Center (Bao’an). As one of the most influential IoT exhibitions in China, this year’s event attracted around 379 exhibitors and more than 2,000 visitors.
XiamenXindeco IoT Technology Co., Ltd. (“Xindeco IoT”), together with Xindeco Link, showcased a full portfolio of new RFID tag products and two highly popular application demonstrations at the exhibition, drawing great attention from attendees.
At the same time, during the “IOTE Gold Award” ceremony held alongside the exhibition, Xindeco IoT’s chip module product received the prestigious Gold Innovation Award
IOTE Gold Award-Winning Product — Chip Module Series
QFN Module
The QFN module delivers superior electrical performance and environmental durability. Compact, lightweight, and cost-effective, it is designed for applications with stringent space requirements. It can also serve as an intermediate component for different RFID packaging types. This packaging approach outperforms traditional wire-bond packaging, offering a cost-effective alternative to wafer-level chip-scale packaging. Additionally, it supports a wide range of features such as anti-metal, dual-frequency, and tri-frequency attributes.
COB Module
The COB module features a miniature antenna design with a compact design and reliable read performance. It can be used directly or in a coupling mode to enhance chip performance. Manufactured with adapted optoelectronic industry equipment and gold wire bonding, the module ensures stability, low shrinkage, improved conductivity and durability, while also achieving higher production efficiency, better overall performance, and reduced cost.
In recent years, Xindeco IoT has collaborated with leading domestic chip manufacturers to complete the testing and integration of multiple UHF chip series, which have already been applied in China’s new retail sector. Several of these domestically developed chip products gained widespread attention during the exhibition.
Meanwhile, Xindeco Link presented on-site demonstrations of RFID smart retail applications and asset lifecycle management systems, allowing visitors to experience firsthand the tangible benefits of RFID technology. The interactive showcase highlighted how RFID can save time, effort, and costs—making this booth one of the most popular at the event.
Time-saving: Rapid batch inventory of over 200 items or assets per second, boosting efficiency by 50%–200%.
Effort-saving: Contactless and long-distance identification up to 5–10 meters, reducing labor costs by over 50%.
Cost-saving: Comprehensive monitoring of inventory, usage, and storage locations, enabling fast item tracking and improving time and space utilization.
As one of the world’s top three RFID tag manufacturing bases, Xindeco IoT continues to advance with a philosophy of integration, empowerment, and symbiosis. By building an industry ecosystem and driving RFID applications across broader sectors, the company is committed to creating a better life through IoT innovation.
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