To accelerate IoT application and drive industry development through exemplary use cases, the Xiamen IoT Industry Association organized the 2023 Outstanding IoT Products and Solutions selection event, under the guidance and support of the Xiamen Municipal Bureau of Industry and Information Technology. The program called for submissions from across the city, and after expert evaluations, municipal review, and comprehensive assessments, Xiamen Xindeco IoT Technology Co., Ltd. (hereinafter referred to as “Xindeco IoT”) was honored with the inclusion of its chip module products in the third batch of Xiamen’s Outstanding IoT Products.
During product development, Xindeco IoT has consistently adhered to principles of innovation and rigorous quality control, continuously introducing smarter and more convenient products. This recognition reflects the company’s proven product quality and technological capabilities.
QFN Module Series
Models: XDIOT2-1010, XDIOT2-1616, XDIOT2-2121
With a compact size of just 1.0×1.0mm, these modules support storage, computation, control, and other functionalities. The packaged chips use commonly adopted NXP Ucode8 and can also accommodate various sizes of low-power microcontrollers (MCUs) and multifunctional chips.
Highlights:
Compact Size: Only 1.0×1.0mm, suitable for space-constrained applications.
Multi-Functionality: Supports storage, processing, and control to meet diverse application needs.
SMT Mounting: Easy to mount on different boards, improving production efficiency.
Wide Applications: Ideal for smart accessories in sports, health care, mobile phones, and tablets.
COB Module Series
Models: XDIOT1-1, XDIOT1-2, XDIOT1-3, XDIOT1-4
Measuring 6×6mm, these modules are equipped with Impinj R6-P or NXP Ucode8 chips, offering different performance characteristics for various applications.
Highlights:
Variety: Multiple models available to meet diverse application requirements.
Packaging Options: Available in gold wire and flip-chip configurations to suit different manufacturing needs.
Antenna Design: Single-layer and double-layer antenna designs enable flexible use in water-washable or other demanding environments.
Wide Applications: Applicable in apparel, home textiles, and other industries.
Looking ahead, Xindeco IoT will continue to strengthen product R&D and innovation capabilities, driving the practical application and commercialization of its technologies to support digital transformation across industries. The company remains committed to monitoring market needs, understanding end-user requirements, and continuously improving products based on feedback, aiming to become a globally leading provider of RFID tags and modules.
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